35x35x14mm Aluminium Heat Sink Heatsink for Chip IC LED BGA Cooling

The 35×35×14mm heatsink is a black anodised aluminium heat sink for chip packages, ICs, LED drivers, and BGA components where moderate footprint and deep fins are both needed. At 14 mm tall, this 35×35×14mm heatsink has deeper fins than flatter options, giving it a larger surface area for passive cooling of mid-power components. The black anodised finish radiates heat more effectively than bare aluminium. For example, it suits voltage regulators, motor driver ICs, and high-brightness LED packages that dissipate a few watts continuously. Key Features of the 35×35×14mm Heatsink Dimensions: 35 mm × 35 mm × 14 mm — deeper fins than compact options for better passive cooling Black anodised aluminium — enhanced radiative heat dissipation Suitable for chip ICs, LED drivers, BGA packages, transistors, and voltage regulators Compatible with thermal adhesive tape or thermal epoxy mounting Use Cases Voltage regulators and power management ICs on 3D printer control boards LED driver thermal management for high-brightness LED arrays BGA chip cooling in embedded computing and FPGA boards General electronics projects requiring passive cooling for mid-power components Works Well With 9×9×12mm Heatsink for A4988/DRV8825 — a compact 9×9mm option for smaller ICs like stepper drivers on the same board 50mm Axial Cooling Fan 5V/12V/24V — pair with a fan to add active cooling for higher-power components Project Ideas & Tutorials Motor Heat Sink: When and How to Add Cooling — Zbotic — explains when heatsinks are needed and how to attach them to motor drivers and ICs DRV8825 Stepper Motor Driver Arduino Tutorial — Last Minute Engineers — covers IC heatsink selection and installation in a maker context Package Contents 1 × 35×35×14mm black anodised aluminium heatsink